BGA SSD condenses the storage solution into a chip-scale footprint, redefining end-side storage with small size, high reliability and high performance.
Embedded Storage · BGA SSD
Compact size. The BGA SSD uses a one-piece package measuring as little as 16 × 20 mm (291 ball), only 1/14 the volume of an M.2 2280 SSD. It comfortably handles the strict space limits of a mainboard, giving customers more room for their board design.
Embedded Storage · BGA SSD
High reliability. All components of the BGA SSD are enclosed inside the package, eliminating the potential failure points caused by physical connections and effectively improving shock and vibration resistance.
GenstorAIge Technology (Beijing) Co., Ltd. draws on more than 20 years of IT experience and a strong local R&D team. It provides enterprise-, industrial- and automotive-grade SSDs, PCIe Gen5/6 Retimer and Redriver ICs, and AI training-and-inference solutions for customers in China and worldwide.
Based on the JEDEC standard and the latest PCIe interface, the PCIe 4.0 BGA SSD reaches sequential read and write speeds of up to 4,900 MB/s and 4,300 MB/s, and the next-generation PCIe 5.0 reaches up to 9,600 MB/s and 9,000 MB/s.
While maintaining high performance, active power is also better than comparable products. It easily handles the high-speed data access and low-latency transmission needs of end-side intelligent devices, quickly processing complex intelligent tasks so every data call is efficient and precise.
Server RAID cards, industrial control mainboards, edge computing devices and flagship smart terminals, and the main storage device under the future trend of vehicle domain-control centralization and vehicle-cloud collaboration, such as smart cockpits, ADAS and TCUs.
All BGA SSD components are enclosed inside the package, eliminating potential failure points such as poor contact, vibration loosening and oxidation that connectors, slots and external components can introduce. Its shock and vibration resistance is inherently a grade higher than plug-in solutions, raising overall product reliability.
| Product | BGA SSD | |
|---|---|---|
| Interface | PCIe Gen 4x4 | PCIe Gen 5x4 |
| CTL process | 12nm | 6nm |
| Status | MP | 27Q3 CS |
| ECC | LDPC | LDPC |
| Security encryption | TCG OPAL | TCG OPAL |
| NAND type | 3D TLC/pSLC, High Endurance with pSLC | 3D TLC/pSLC, High Endurance with pSLC |
| Package | 291 Balls Type 1620, 16.0 x 20.0 mm | 291 Balls Type 1620, 16.0 x 20.0 mm |
| Capacity | TLC: 64GB-1TB; pSLC: 40GB-320GB | TLC: 256GB-1TB, 2TB/4TB Option; pSLC: 80GB-320GB |
| Performance | Seq R/W up to 4900/4300 MB/s | Seq R/W up to 9600/9000 MB/s |
| Power consumption | 3.5W | - |
| Endurance | TLC P/E Cycle 3,000; pSLC P/E Cycle: 100,000 | TLC P/E Cycle 3,000; pSLC P/E Cycle: 100,000 |
| Intelligent thermal throttling | Y | Y |
| Operating temperature | 0°C-70°C / -40°C-85°C | 0°C-70°C / -40°C-85°C |
| Product PN | GASNE3D222XXXXG | - |
| Note | The three X digits before G indicate capacity, e.g. 040G | |
GenstorAIge Technology (Beijing) Co., Ltd.: Building AI-Native storage, to make data more intelligent.
